IBM’s subsidiary, Anderon, has signed a $1 billion agreement with the US Department of Commerce under the CHIPS program. The funds will be used to develop quantum wafer production at a facility in Albany, New York.
The corporation and the government agency announced the deal in May 2026, signing a letter of intent. At that time, IBM also announced the creation of Anderon as the first US-based 300-mm quantum wafer production facility for various developers, not just a single client.
According to IBM, the facility utilizes technologies, specialized equipment, and expertise from the parent company. Production focuses on wafers for superconducting qubit arrays, quantum input-output components, and readout circuits.
Anderon claims that the first products are already moving through the production line. The next step is to expand the range to other quantum modalities.
As part of the deal, IBM has committed to providing Anderon with $1 billion in funding from its own resources.
The project is part of the corporation’s plans to expand its quantum business. In June, IBM announced its intention to invest more than $10 billion in quantum computing over five years, including research, manufacturing, deals, and ecosystem development.
In July, IBM CEO Arvind Krishna stated that investments in quantum technologies are expected to significantly impact IBM’s revenue and profit by 2028-2029.
